0000020904 00000 n Simple Ans is – if you have more output capacitance load then it will take more time to charge /discharge to/from. No portion of this site may be copied, retransmitted, reposted, duplicated or otherwise used without the express written permission of Design And Reuse. I thought this might be an option for fix, what do you think? 3) Break the … It is therefore prudent to fix DRVs earlier in the design cycle. After clock DRV fixing, you can perhaps do a data DRC/DRV fixing.


Yeah, as other Anonymous commenter said, this is more reliability (sigem) concern than delay.

One is a reset and the others are not clock or reset.

-> Why is setup checked on the next edge and hold on the same edge? Resizing is preferable to buffer insertion since it is less disruptive. I have a design which is placed and routed successfully, but there are around 50 max cap violations that I do not know how to fix them.

The Answer to Non-Volatile Memory Security Issues at Advanced Nodes: Go Volatile! Buffer insertion would also help fixing max_capacitance violations as well. The slack for max cap violation is -1.80, is that too bad? max_delay/setup ('Clk' group) Timing Violations Required Actual Pin Capacitance Capacitance Slack Clk 0.00 0.03 -0.03 (VIOLATED) Reset 0.00 0.01 -0.01 (VIOLATED) max_capacitance DRC Violations If the report is empty, there are no violations. It is so because usually, the DRVs which directly impact timing are proactively fixed by the designers, but the ones which do not impact timing (or having sufficient positive setup slack) are often left till the last phase of the design cycle, since timing closure is the topmost priority job. They are all high fanout transition nets but not necessarily the highest. I would digress slightly away from topic, but technology refers to the minimum dimensions that can be drawn.

edge delay at sink(R): CoeffMEM/C2_mem_reg[17][6]/CP 4775.7(ps), Rise Phase Delay               : 4775.7~5064.6(ps)      1000~10000(ps), Fall Phase Delay               : 4329.3~4991.3(ps)      1000~10000(ps), Trig. or I can ignore it?Thank you in advance. The most important thing to do after each step is to verify the timing slack and revert the ones resulting in timing degradation. So, technology is just a placeholder for minimum dimensions.Coming back to query, increasing cell size means increasing "W" while keeping "L" constant for all the transistors in the cell. 0000004233 00000 n
I read in the Forum that it may not be the best to insert high buffer trees on these nets.

Modify the Driver Cell in different ways. 0000018427 00000 n The solution to the problem requires timing and congestion feedbacks.

Wherever it was possible driver cells were up sized. (max_fanout), Part 1c ->  Maximum (and minimum) capacitance (max_capacitance and min_capacitance), Part 1d ->  Cell degradation (cell_degradation).

Because mostly i heared like the entire chip will be made up by single technology like (0.28nm chip).

It is the job of the library characterization teams to characterize the standard cells/basic building blocks. so How can we fix the violation of max_capacitance?

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